Adhesion strength improved in D/B, W/B and M/D processes
Solution
for delamination in mold process
Customer-tailored design
SystemDimension | 1750(W)x 1250(D) x 1700(H)mm |
---|---|
InternalChamber Dimension | 342.2(W)x 652.2(D) x 27.5(H)mm |
PowerSource | STD.RF generator, 1KW, 13.56MHz |
VacuumPump | STD.Dry Pump |
GasFlow controller | 1Mass Flow Controller |
PCBased Main Control | IndustrialPC, C++, Touch Panel |
ActualSPH | 560Strips/h (5 lanes) |
Utility | 220VAC, 3 Phase, 50/60Hz, Air 4~6 Kgh/cm3 |
-Strip-based plasma system
-Automatic loading/unloading
-Rotating stage design
-Structure of electrode on top chamber
-Same loading/unloading stage zone
-Vacuum pump embedded design
-LAN networking and CIM
-Gripper moving type