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VSP-888 SH2

VSP-888 SH2

Application

Improved system for forming bump on wafer level package
Selective descumming and stable electroplating

Specification

PlasmaSource ICP& RF bais
WaferSize 200mm/ 300mm
WaferTransfer ATMTransfer
SystemDimension 2970(W)x 2210(D) x 1800(H)mm
ProcessChamber Max4
Application Descum(PR, PI, PBO, BCB)
SurfaceModification
Etch(SiO2,Si3N4)
Operating Software Windows7
FIDES– cluster control software

Features

- High throughput : ~ < 170 WPH
- Good Etching Uniformity : < 3%
- ATM dual hands platform
- Low CoC By optimized simple chamber design